Manufacturers of smartphones want to start using evaporative chambers in the cooling systems of these devices. It is assumed that this will improve the cooling efficiency. The testing of new cooling systems has already started the company Asustek Computer and ZTE. It is alleged that the company is also interested in this technology.

The development of cooling systems with evaporation chambers intended for smartphones is carried out by Taiwanese companies Chaung Choung Technology, Asia Vital Components and TaiSol Electronics, as well as Japanese Furukawa Electric.

While most smartphone manufacturers confined themselves to conventional radiators, Samsung Electronics and LG Electronics switched to 0.35-0.40 mm thick heat pipes supplied by Chaung Choung, Furukawa Electric, Auras Technology and Delta Electronics.

The efficiency of the evaporation chamber exceeds the heat pipes. Now available evaporative chambers with a thickness of 0.38 mm. Further reduction in thickness is associated with technological difficulties and leads to a decrease in the percentage of yield of the products.